George Vakanas: Difference between revisions

# Thin NiB or CoB capping layer for non-noble metal bond pads. BEYNE, ERIC | DE VOS, JOERI | DERAKHSHANDEH, JABER | ENGLAND, LUKE | VAKANAS, GEORGE. Patent Number: EP 2924727 (2020)

# Thin NiB or CoB capping layer for non-noble metallic bonding landing pads. Beyne, Eric | De Vos, Joeri | Derakhshandeh, Jaber | England, Luke | Vakanas, George. Patent Number: US 10,066,303 (2018)

# Laser-assisted chemical singulation of a wafer. Li, Eric | Chen, George | Vakanas, George | Voronov, Sergei | Greenzweig, Yuval. Patent Number: US 8,426,250 (2013)

# Method of fabricating an identification mark utilizing a liquid film assisted by a laser. Vakanas, George P. | Voronov, Sergei L. | Ng, Luey Chon | Malouf, George E. Patent Number: US 8,173,552 (2012)

# Clipless integrated heat spreader process and materials. Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel. Patent Number: US 8,163,598 (2012)

# Clipless integrated heat spreader process and materials. Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel. Patent Number: US 7,892,883 (2011)

# Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates. Winer, Paul | Vakanas, George P.. Patent Number: US 7,446,382 (2008)

# Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates. Winer, Paul | Vakanas, George P.. Patent Number: US 6,878,567 (2005)