George Vakanas: Difference between revisions
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==Patents== | |||
Thin NiB or CoB capping layer for non-noble metal bond pads | |||
BEYNE, ERIC | DE VOS, JOERI | DERAKHSHANDEH, JABER | ENGLAND, LUKE | VAKANAS, GEORGE | |||
Patent Number: EP 2924727 (2020) | |||
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | |||
Beyne, Eric | De Vos, Joeri | Derakhshandeh, Jaber | England, Luke | Vakanas, George | |||
Patent Number: US 10,066,303 (2018) | |||
Laser-assisted chemical singulation of a wafer | |||
Li, Eric | Chen, George | Vakanas, George | Voronov, Sergei | Greenzweig, Yuval | |||
Patent Number: US 8,426,250 (2013) | |||
Method of fabricating an identification mark utilizing a liquid film assisted by a laser | |||
Vakanas, George P. | Voronov, Sergei L. | Ng, Luey Chon | Malouf, George E. | |||
Patent Number: US 8,173,552 (2012) | |||
Clipless integrated heat spreader process and materials | |||
Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel | |||
Patent Number: US 8,163,598 (2012) | |||
Clipless integrated heat spreader process and materials | |||
Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel | |||
Patent Number: US 7,892,883 (2011) | |||
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates | |||
Winer, Paul | Vakanas, George P. | |||
Patent Number: US 7,446,382 (2008) | |||
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates | |||
Winer, Paul | Vakanas, George P. | |||
Patent Number: US 6,878,567 (2005) | |||
Revision as of 01:45, 13 August 2026
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Dr. George Vakanas was a Founding Member of MISnTED Ltd., CYBER KIDS and Cyprus Neuroscience and Technology Institute. He left the group in 1996 first to create a competitive company called CYBERnet and subsequently he moved to the United States to complete his PhD at Stanford University. He is now Head of a Lab for Intel.
Key organiser of major pioneer events in Cyprus
Patents
Thin NiB or CoB capping layer for non-noble metal bond pads BEYNE, ERIC | DE VOS, JOERI | DERAKHSHANDEH, JABER | ENGLAND, LUKE | VAKANAS, GEORGE Patent Number: EP 2924727 (2020)
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads Beyne, Eric | De Vos, Joeri | Derakhshandeh, Jaber | England, Luke | Vakanas, George Patent Number: US 10,066,303 (2018)
Laser-assisted chemical singulation of a wafer Li, Eric | Chen, George | Vakanas, George | Voronov, Sergei | Greenzweig, Yuval Patent Number: US 8,426,250 (2013)
Method of fabricating an identification mark utilizing a liquid film assisted by a laser Vakanas, George P. | Voronov, Sergei L. | Ng, Luey Chon | Malouf, George E. Patent Number: US 8,173,552 (2012)
Clipless integrated heat spreader process and materials Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel Patent Number: US 8,163,598 (2012)
Clipless integrated heat spreader process and materials Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel Patent Number: US 7,892,883 (2011)
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates Winer, Paul | Vakanas, George P. Patent Number: US 7,446,382 (2008)
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates Winer, Paul | Vakanas, George P. Patent Number: US 6,878,567 (2005)