George Vakanas: Difference between revisions

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==Patents==
==Patents==


Thin NiB or CoB capping layer for non-noble metal bond pads
# Thin NiB or CoB capping layer for non-noble metal bond pads. BEYNE, ERIC | DE VOS, JOERI | DERAKHSHANDEH, JABER | ENGLAND, LUKE | VAKANAS, GEORGE. Patent Number: EP 2924727 (2020)
BEYNE, ERIC | DE VOS, JOERI | DERAKHSHANDEH, JABER | ENGLAND, LUKE | VAKANAS, GEORGE
# Thin NiB or CoB capping layer for non-noble metallic bonding landing pads. Beyne, Eric | De Vos, Joeri | Derakhshandeh, Jaber | England, Luke | Vakanas, George. Patent Number: US 10,066,303 (2018)
Patent Number: EP 2924727 (2020)
# Laser-assisted chemical singulation of a wafer. Li, Eric | Chen, George | Vakanas, George | Voronov, Sergei | Greenzweig, Yuval. Patent Number: US 8,426,250 (2013)
 
# Method of fabricating an identification mark utilizing a liquid film assisted by a laser. Vakanas, George P. | Voronov, Sergei L. | Ng, Luey Chon | Malouf, George E. Patent Number: US 8,173,552 (2012)
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
# Clipless integrated heat spreader process and materials. Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel. Patent Number: US 8,163,598 (2012)
Beyne, Eric | De Vos, Joeri | Derakhshandeh, Jaber | England, Luke | Vakanas, George
# Clipless integrated heat spreader process and materials. Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel. Patent Number: US 7,892,883 (2011)
Patent Number: US 10,066,303 (2018)
# Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates. Winer, Paul | Vakanas, George P.. Patent Number: US 7,446,382 (2008)
 
# Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates. Winer, Paul | Vakanas, George P.. Patent Number: US 6,878,567 (2005)
Laser-assisted chemical singulation of a wafer
Li, Eric | Chen, George | Vakanas, George | Voronov, Sergei | Greenzweig, Yuval
Patent Number: US 8,426,250 (2013)
 
Method of fabricating an identification mark utilizing a liquid film assisted by a laser
Vakanas, George P. | Voronov, Sergei L. | Ng, Luey Chon | Malouf, George E.
Patent Number: US 8,173,552 (2012)
 
Clipless integrated heat spreader process and materials
Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel
Patent Number: US 8,163,598 (2012)
 
Clipless integrated heat spreader process and materials
Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel
Patent Number: US 7,892,883 (2011)
 
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates
Winer, Paul | Vakanas, George P.
Patent Number: US 7,446,382 (2008)
 
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates
Winer, Paul | Vakanas, George P.
Patent Number: US 6,878,567 (2005)

Revision as of 01:47, 13 August 2026

George Vakanas
George Vakanas
Years of service 1991 - 1996
Service type Board Member
Current Post Intel
Degree(s) Phd
Field(s) of Study Aerospace engineering, Mechanical Engineering
University(ies) University of Arizona, Stanford
Notable Achievements Founding Member of CYBER KIDS, MISnTED Ltd. and Cyprus Neuroscience and Technology Institute.
External Links External Link(s)



Dr. George Vakanas was a Founding Member of MISnTED Ltd., CYBER KIDS and Cyprus Neuroscience and Technology Institute. He left the group in 1996 first to create a competitive company called CYBERnet and subsequently he moved to the United States to complete his PhD at Stanford University. He is now Head of a Lab for Intel.


Key organiser of major pioneer events in Cyprus

Patents

  1. Thin NiB or CoB capping layer for non-noble metal bond pads. BEYNE, ERIC | DE VOS, JOERI | DERAKHSHANDEH, JABER | ENGLAND, LUKE | VAKANAS, GEORGE. Patent Number: EP 2924727 (2020)
  2. Thin NiB or CoB capping layer for non-noble metallic bonding landing pads. Beyne, Eric | De Vos, Joeri | Derakhshandeh, Jaber | England, Luke | Vakanas, George. Patent Number: US 10,066,303 (2018)
  3. Laser-assisted chemical singulation of a wafer. Li, Eric | Chen, George | Vakanas, George | Voronov, Sergei | Greenzweig, Yuval. Patent Number: US 8,426,250 (2013)
  4. Method of fabricating an identification mark utilizing a liquid film assisted by a laser. Vakanas, George P. | Voronov, Sergei L. | Ng, Luey Chon | Malouf, George E. Patent Number: US 8,173,552 (2012)
  5. Clipless integrated heat spreader process and materials. Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel. Patent Number: US 8,163,598 (2012)
  6. Clipless integrated heat spreader process and materials. Kostiew, George | Bahadur, Raj | Mellody, James | Vakanas, George | Arana, Leonel. Patent Number: US 7,892,883 (2011)
  7. Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates. Winer, Paul | Vakanas, George P.. Patent Number: US 7,446,382 (2008)
  8. Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates. Winer, Paul | Vakanas, George P.. Patent Number: US 6,878,567 (2005)